SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF part number 24560061 is an EMC cover plate designed for the EuropacPRO series. It features a 3U rack unit height and supports a horizontal pitch of 84 HP. The component has a depth of 275 mm and is constructed from aluminum with a natural color finish. This cover plate provides electromagnetic compatibility shielding, typically used in conjunction with horizontal rails to ensure effective EMI protection within industrial electronic packaging systems.
Verify that the required depth matches the specific application needs, as this model is fixed at 275 mm. Confirm compatibility with existing 84 HP horizontal rail systems within the EuropacPRO ecosystem. Ensure that the 3U form factor aligns with the overall rack structure dimensions. Check for any specific surface treatment requirements if standard natural anodized finish is insufficient for the operating environment.
Select this component when EMC shielding is required for a 3U high module with an 84 HP width footprint. The 275 mm depth must be compatible with the internal space constraints of the target enclosure. Consider the aluminum construction for lightweight structural integrity. Verify that the natural color finish meets aesthetic or corrosion resistance standards for the intended installation location.
This part belongs to the nVent SCHROFF EuropacPRO series, a standardized line of rack components compliant with IEC 60297-3 standards. The series offers modular solutions for electronics packaging, emphasizing interoperability and robust mechanical design. Part 24560061 serves as a critical shielding element within this modular architecture, ensuring signal integrity in sensitive electronic environments.
No direct public substitute part numbers are confirmed for this specific model. Compatibility depends on matching the 3U height, 84 HP width, and 275 mm depth specifications exactly. Alternative EMC covers from other manufacturers may fit mechanically but might not guarantee identical shielding performance or mounting interface alignment.

Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
Choose an AC to DC converter by input range, output demand, isolation, efficiency and thermal derating. Compare architectures and check installation needs.
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read More
The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More