SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 24564118 is a horizontal board expansion kit designed for use with 3U and 4U high subracks. It facilitates the horizontal mounting of double Euroboards within 19-inch rack systems. The kit supports a width of 20HP (Hartmann Pitch) and is constructed from die-cast zinc, providing robust mechanical support for board cage applications in EuropacPRO subracks and chassis environments.
Verify that the target enclosure is a 3U or 4U high subrack compatible with double Euroboards. Confirm the required width is 20HP to ensure proper fit. Check manufacturer documentation for specific mounting hardware requirements and compatibility with existing rack accessories. Ensure the application environment suits the die-cast zinc material properties.
Select this kit when horizontal board expansion is required for 3U or 4U high enclosures. It is specifically intended for double Euroboard configurations. Ensure the system utilizes 19-inch rack standards. This component serves as a mounting solution rather than an active electronic part. Verify spatial constraints within the chassis before procurement.
This component belongs to the nVent SCHROFF range of rack accessories and mechanical infrastructure solutions. It is categorized under board expansion kits and rack mounting hardware. The product line focuses on providing standardized mechanical interfaces for industrial electronics integration within 19-inch rack frameworks.
Public confirmed substitute part numbers are not available in the provided source data. Consult official nVent SCHROFF catalogs for equivalent horizontal expansion kits matching specific U-heights and HP widths.
A digital-to-analog converter (DAC) turns a digital number into an analog voltage or current. It lets a controller set a physical output, such as…
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read MoreON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More