SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 24566449 is a side panel component designed for the ratiopacPRO series of electronics enclosures. It features a height of 6 HE (High Units) and a depth of 295mm, with a width corresponding to standard 19-inch rack mounting configurations. Constructed from aluminum, this part serves as a vertical structural element for patch cabinets or equipment racks. The material provides durability while maintaining a lightweight profile suitable for industrial and commercial electronic housing applications.
Verify compatibility with specific ratiopacPRO series models before procurement. Confirm that the 6 HE height and 295mm depth match the intended enclosure design requirements. Ensure that the 19-inch width specification aligns with existing rack infrastructure. Check manufacturer documentation for any updates regarding material specifications or mounting hole patterns to guarantee proper fitment within the system architecture.
Select this component when a fixed side panel is required for a 19-inch rack system with a 6 HE height constraint. The 295mm depth must be compatible with the internal component layout and rear access needs. Consider the aluminum construction for its balance of strength and weight. This part is strictly a structural element and does not include active components or integrated cooling features.
This part belongs to the nVent SCHROFF portfolio, a leader in electronics packaging solutions. The ratiopacPRO series offers modular enclosure platforms for various industrial applications. Side panels like the 24566449 are essential for completing the structural integrity of these rack systems, providing mounting surfaces and protection for internal equipment.
No direct public substitute part numbers are confirmed for this specific dimension and series combination. Verify if other Schroff side panels with identical 6 HE height and 295mm depth can serve as alternatives, ensuring exact dimensional and mounting pattern compatibility.

Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
Learn how a diode conducts, how to identify anode and cathode, and when to choose rectifier, TVS, Zener or photodiode types for a circuit.
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read More
Learn how rectifiers convert AC to DC, compare half-wave and bridge circuits, and select voltage, current, recovery and thermal ratings for your design.
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More
Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More