24LCS22AT-I/SN

Memory IC Overview

The Microchip Technology 24LCS22AT-I/SN is a 2Kbit (256 x 8-bit) dual-mode serial EEPROM housed in an 8-pin SOIC package. It operates on a single supply voltage ranging from 2.5V to 5.5V and supports I²C-compatible interfaces with clock frequencies up to 100 kHz at 2.5V and 400 kHz at 5V. The device features industrial temperature ratings from -40°C to +85°C, 1 million erase/write cycles, and data retention exceeding 200 years.

Memory IC Feature Summary

• Supports dual-mode operation including Transmit-Only mode for EDID applications and Bidirectional mode for full read/write access via I²C
• Includes hardware write-protect capabilities controlled by the WP pin and VCLK logic level
• Features a page write buffer allowing storage of up to eight bytes before internal programming

Memory IC Applications

• Monitor identification compliant with DDC1 and DDC2 standards
• Enhanced EDID (E-EDID) 1.3 implementation
• Storage of configuration and control information requiring serial transmission

Memory IC Procurement Notes

Verify that the 'T' suffix indicates tape-and-reel packaging rather than tube. Confirm the 'I' suffix matches the required industrial temperature range of -40°C to +85°C. Ensure the specific revision aligns with current RoHS compliance requirements.

Memory IC Selection Notes

Select this component when both continuous display data transmission and bidirectional memory updates are necessary. It is suitable for systems requiring low standby current and robust noise protection through Schmitt Trigger inputs on all signal pins.

Memory IC Part Context

This part belongs to the 24LCS22A family of serial EEPROMs designed specifically for Display Data Channel (DDC) applications. It integrates non-volatile memory with specialized logic to handle monitor identification protocols while maintaining standard I²C compatibility for system configuration.

Memory IC Replacement Considerations

Direct substitutes include other 24LCS22A variants within the same Microchip series. Verify package type and temperature grade compatibility before substitution.