SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF 26230174 is a side panel designed for Slim-Line enclosures. It features a steel construction with a RAL 7035 light grey finish. The component measures 800 mm in width and 20 U in height. It is engineered for quick fastener mounting to facilitate easy installation within aluminum frame structures.
Verify the exact part number 26230174 against official nVent SCHROFF documentation to ensure compatibility with your specific Slim-Line enclosure model. Confirm that the required dimensions of 800mm width and 20U height match your system design requirements before procurement.
Select this component when a solid steel side panel is required for a Slim-Line enclosure system. Ensure the mounting interface aligns with the specific aluminum frame profile used in your assembly. Verify that the RAL 7035 finish meets your environmental or aesthetic specifications.
This part belongs to the nVent SCHROFF range of electronic packaging solutions. It serves as a structural cladding element, providing lateral support and enclosure integrity for modular rack systems. The product is distinct from front doors or base plates within the same series.
No public confirmed substitute part numbers are available in the provided source data.

Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read MoreSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More