SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 26230461 is a rear panel component designed for 19-inch rack mounting systems. It features cable entry capabilities and provides 47U of vertical space within the assembly. The unit measures 7035 mm in width, accommodating standard equipment widths. This accessory supports structured cabling management at the rear of electronic enclosures or subracks, ensuring organized connectivity for installed modules.
Verify the specific dimensional requirements against your enclosure design before procurement. Confirm that the 47U height aligns with your system's total rack unit allocation. Ensure compatibility with existing rear mounting hardware and cable routing paths to avoid integration issues during installation.
Select this part when rear cable entry is required alongside significant vertical space utilization. Consider the 7035mm width constraint relative to your chassis depth. Evaluate if the integrated ventilation needs match your thermal management strategy, as the design may impact airflow compared to solid panels.
This component belongs to the nVent SCHROFF range of rack accessories and electronics packaging solutions. It complements their portfolio of 19-inch chassis and cabinets by providing specialized rear infrastructure. The product supports scalable and modular system designs common in industrial and laboratory environments.
No public confirmed substitute part numbers are available for direct replacement. Verify mechanical fitment carefully if considering alternative rear panels from other manufacturers due to potential dimensional variances.

Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read More
Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More
The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read More
Recently, the global electronic component market has witnessed complex and changeable trends. In the memory chip sector, the wave of price increases continues to…
Read More