SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF 30118341 is an aluminum front panel from the 30118 series, designed for rack mounting systems. It features a non-shielded construction with dimensions of 128.4 mm in width and 19.8 mm in height (equivalent to 1U). The panel includes a single Sub-D connector cut-out configured for a 9-pin interface, facilitating straightforward connectivity access within standard equipment enclosures.
Verify that the required connector type matches the 9-pin Sub-D specification. Confirm that electromagnetic shielding is not required for the specific application environment, as this unit is non-shielded. Ensure rack compatibility with the 128.4 mm width dimension before procurement.
Select this model when a simple, unshielded front panel is needed for 9-pin D-Sub connections. Consider shielded variants if EMI protection is necessary. Verify that the 1U height fits the available rack space constraints.
This component belongs to the nVent SCHROFF 30118 series of aluminum front panels. The series offers various configurations with different connector cut-outs and pin counts, allowing for modular customization of rack enclosure fronts while maintaining consistent dimensional standards.
Check part numbers such as 30118342 or 30118343 if a 15-pin or 25-pin Sub-D interface is required instead. Ensure any substitute maintains the same 128.4 mm width and 1U height specifications for proper rack fit.

PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read More
Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More
STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
Read More