SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF part number 30118351 is a front panel designed for mounting in subracks, cases, and rack systems. It features a 2x9 way configuration with connector cutouts. The unit has a height of 3U and a width of 4HP. It is constructed as a flat, unshielded panel suitable for professional industrial, research, and measurement technology applications.
Verify the exact part number 30118351 against official nVent SCHROFF documentation to confirm current availability and specifications. Check for any recent updates to the datasheet or RoHS compliance status before finalizing procurement decisions.
Select this component when a 3U high, 4HP wide front panel with 2x9 connector cutouts is required. Ensure the application does not require electromagnetic shielding, as this model is specified as unshielded. Confirm compatibility with the target subrack or case dimensions.
This component belongs to the nVent SCHROFF front panel series, which provides standardized solutions for electronics packaging. The brand specializes in enclosure and system technology for professional use in industry and research sectors.
Cross-reference part numbers such as 30118-350 or 30849-750 from the same manufacturer series if alternative configurations are needed. Verify dimensional and functional equivalence before substitution.

Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read MoreSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read MoreWilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
WILMINGTON, Mass. – August 11, 2026 — Analog Devices, Inc. (NASDAQ: ADI), the global leading supplier of high-performance analog, mixed-signal and digital signal processing…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More