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302-030-658-201 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is 302 SERIES (.05" (1.27MM) CONTAC. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 302-030-658-201 is a standard card edge connector from the 302 series, featuring a 0.050" (1.27mm) contact spacing. It provides 30 positions in a dual-row configuration with gold flash plated contacts. The housing is black polyamide (PA66), designed for non-specified dual-edge cards with thicknesses ranging from 0.051" to 0.071" (1.30mm to 1.80mm). This component utilizes cantilever contacts and supports through-hole termination.
Verify the specific pin count and row configuration against the official datasheet before integration. Confirm that the target PCB design accommodates the required through-hole termination style and mounting constraints. Ensure compatibility with the specified card thickness range of 1.30mm to 1.80mm to guarantee proper mechanical fit and electrical performance.
Select this model when a 1.27mm pitch dual-edge connector is required for general-purpose applications. The 30-position capacity suits moderate density interconnect needs. Consider the PA66 housing material for standard environmental conditions. Verify that the cantilever contact mechanism aligns with the insertion force requirements of the target system design.
This component belongs to the EDAC 302 series, which specializes in standard card edge connectors with 1.27mm spacing. The series offers various position counts and termination options. The 302-030-658-201 specifically addresses applications requiring a 30-pin dual-row interface with gold plating for corrosion resistance and signal integrity.
Consult the official EDAC catalog for direct substitutes within the 302 series. Verify identical parameters such as 1.27mm pitch, 30 positions, dual-row layout, and through-hole termination before substitution.
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