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305-016-521-501 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 16POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-016-521-501 is a dual-row card edge connector designed for through-hole mounting. It features 16 positions with a 0.156-inch (3.96 mm) contact spacing and a 0.140-inch row spacing. The connector accepts printed circuit boards with thicknesses ranging from 0.054 to 0.070 inches (1.37 mm to 1.78 mm). Constructed with copper alloy contacts featuring a gold finish, it ensures reliable electrical performance. The insulator body is made of green thermoplastic polyester, supporting an operating temperature range of -40°C to +105°C.
Verify the specific ordering suffix against the manufacturer's official datasheet to ensure compatibility with required board thickness and termination styles. Confirm that the selected variant matches the intended application environment regarding temperature ratings and material specifications before finalizing procurement orders.
Select this component when a low-profile dual-row connection is required for standard thickness cards. Ensure the design accommodates the specified 0.156-inch pitch and verify that the PCB manufacturing tolerances align with the accepted thickness range of 0.054 to 0.070 inches for proper mechanical engagement.
This part belongs to the EDAC 305 Series, which provides standard card edge connectors for various industrial applications. The series offers multiple position counts and mounting options, allowing designers to scale connectivity requirements while maintaining consistent interface dimensions and performance characteristics across different product lines.
Consult the EDAC 305 Series Ordering Guide for direct substitutes with differing pin counts or mounting configurations. Verify that any alternative maintains the same 0.156-inch pitch and dual-row architecture to ensure mechanical fit without redesigning the host PCB footprint.
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