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305-024-556-512 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 24POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-024-556-512 is a standard card edge connector featuring 24 positions arranged in a dual row configuration. It utilizes a 3.96 mm (0.156 inch) contact spacing with a 3.56 mm row spacing. Designed for panel mount installation at a vertical angle, the unit accepts printed circuit boards with a nominal thickness of 1.57 mm. The contacts are constructed from copper alloy and feature gold plating to ensure reliable signal transmission.
Verify the specific suffix code against the manufacturer's official ordering guide to confirm exact flange dimensions and termination style. Ensure the selected variant matches the required PCB thickness tolerance of 1.37 mm to 1.78 mm. Confirm RoHS compliance status through the latest datasheet documentation before finalizing procurement specifications.
Select this component when a dual-row interface with 3.96 mm pitch is required for vertical panel mounting. The thermoplastic polyester housing provides necessary thermal stability for operating temperatures ranging from -40°C to +105°C. Verify that the target application supports the specified 5 A current rating per contact for safe electrical operation.
This part belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and termination options while maintaining consistent mechanical dimensions. The 305 series is widely utilized in modular electronic systems requiring robust, high-density connections between carrier panels and plug-in circuit boards.
Cross-reference compatible parts within the EDAC 305 family sharing identical 24-position dual-row layouts. Verify that alternative suppliers offer matching 3.96 mm spacing and 1.57 mm board thickness acceptance. Ensure substitute components maintain equivalent gold plating thickness and copper alloy contact materials for performance parity.
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