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305-026-520-503 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 26POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-026-520-503 is a standard card edge connector header designed for vertical panel mount applications. It features a dual female configuration with 26 positions arranged in two rows. The component utilizes a 3.96 mm (0.156 inch) contact spacing and a 3.56 mm row spacing, specifically engineered to accept printed circuit boards with a nominal thickness of 1.57 mm (0.062 inch). Electrical specifications include a current rating of 5 A and an insulation resistance of 5 GOhms. The contacts are constructed from copper alloy with gold plating, while the insulator body is made of thermoplastic material.
Verify the specific suffix codes against official EDAC documentation to confirm exact pin count and termination style. Ensure compatibility with the target PCB thickness of 1.57 mm before integration. Cross-reference the manufacturer part number with authorized distributor catalogs to confirm current availability status and lead times. Request updated datasheets directly from the manufacturer to validate environmental ratings and material certifications prior to final procurement decisions.
Select this component when a vertical, panel-mount solution is required for double-sided edge cards. The 3.96 mm pitch accommodates standard industrial board layouts. Verify that the application environment remains within the specified temperature range of -40°C to +105°C. Confirm that the 5 A current rating meets the power distribution requirements of the connected circuitry. Ensure the mating card edge geometry aligns with the dual-row female contact structure.
This part belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts while maintaining consistent mechanical dimensions and electrical characteristics. The 305 series is widely recognized for its durability and precise alignment capabilities in demanding electronic assemblies. This specific model represents a mid-range position count option within the family, balancing connectivity density with physical footprint constraints.
Direct substitutes must match the 26-position count, 3.96 mm pitch, and vertical panel mount orientation. Verify that alternative components support the same 1.57 mm board thickness and dual-row female interface. Check for identical current ratings and insulation resistance values to ensure functional equivalence in the existing circuit design.
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