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305-036-556-507 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 36POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-036-556-507 is a standard card edge connector from the 305 series, designed for dual-row applications with 36 positions. It features a 3.96 mm (0.156 inch) pitch and accommodates a board thickness of 1.57 mm. The connector utilizes gold plating on the mating area and tin plating with nickel underplating on the tails. Rated for 5 amps continuous current and 1800VACrms insulation voltage, it offers a maximum contact resistance of 10 milliohms. The housing is green polyester thermoplastic.
Verify the specific pin plating configuration against project requirements, as this model specifies tin plating on tails with nickel underplating. Confirm that the 1.57 mm board thickness compatibility matches your PCB design. Ensure the 3.96 mm pitch aligns with the card edge layout. Check for RoHS compliance status if environmental regulations apply to your deployment.
Select this component when polarizing key support is required for the 305 series form factor. The dual-row arrangement suits applications needing 36 contacts in a compact footprint. Consider the 5A current rating for power distribution needs. Verify that the vertical panel mount style fits the enclosure constraints compared to PCB mount alternatives.
This part belongs to the EDAC 305 series of card edge connectors, which are characterized by their robust construction and polarizing key compatibility. The series includes various position counts and mounting styles, serving as a versatile solution for standard card edge applications across different industrial sectors.
Direct substitutes within the same series include parts like 305-034-556-507 or 305-036-556-508, provided they match the required position count and plating specifications. Always verify electrical ratings and mechanical dimensions before swapping components.
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