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305-052-500-501 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 52POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-052-500-501 is a standard card edge connector featuring 52 positions arranged in a dual row configuration. It utilizes a 3.96 mm (0.156 inch) contact spacing with a 3.56 mm row spacing. Designed for panel mounting at a vertical angle, the unit accepts printed circuit boards with a nominal thickness of 1.57 mm. The contacts are constructed from copper alloy and feature gold plating to ensure reliable signal transmission. This component supports a continuous current rating of 5 A and withstands voltages up to 1800 VACrms.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm compatibility with required polarizing keys and termination styles. Ensure that the procurement specifications align with the thermal operating range of -40°C to +105°C. Confirm RoHS3 compliance status through the supplier's documentation before finalizing acquisition orders.
Select this model when a dual-edge female connector with a 3.96 mm pitch is required for panel-mounted applications. The 52-position count suits designs needing substantial I/O density within a single connector footprint. Verify that the target PCB thickness falls within the specified acceptance range of 1.37 mm to 1.78 mm for proper mechanical engagement.
This component belongs to the EDAC 305 series of edgeboard connectors. The series is characterized by its use of thermoplastic insulators and gold-plated copper alloy contacts. The 305 series is engineered for durability in demanding environments, offering consistent performance across various industrial and commercial electronic assemblies.
Cross-reference part numbers within the same 305 series family for alternative position counts. Verify that any substitute maintains the identical 3.96 mm pitch and panel mount orientation to ensure mechanical interchangeability without redesigning the host chassis.
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