305-054-520-207

Edgeboard Connectors Overview

The EDAC 305-054-520-207 is a standard card edge connector header featuring 54 positions with a 3.96 mm pitch. Designed for panel mounting at a vertical angle, it utilizes gold-plated copper alloy contacts and solder pin termination. The unit supports a 1.57 mm board thickness and operates within a temperature range of -40°C to +105°C. It provides a 5 A current rating and 5 GOhms insulation resistance.

Edgeboard Connectors Feature Summary

• Accepts between-contact and in-contact polarizing keys for secure alignment
• Dual row configuration ensures high-density signal routing
• Thermoplastic housing provides stable electrical insulation

Edgeboard Connectors Applications

• Industrial control system backplanes
• Telecommunications equipment interconnects
• High-reliability computing hardware modules

Edgeboard Connectors Procurement Notes

Verify the specific suffix codes against official EDAC documentation to confirm plating thickness and material specifications. Ensure compatibility with the target PCB thickness of 1.57 mm before procurement. Confirm that the vertical panel mount style aligns with the mechanical enclosure design requirements.

Edgeboard Connectors Selection Notes

Select this component when a 54-position dual-row interface is required with a 3.96 mm pitch. The vertical orientation suits panel-mounted applications where space efficiency is critical. Verify that the 5 A continuous current rating meets the circuit load requirements.

Edgeboard Connectors Part Context

This part belongs to the EDAC 305 Series, which offers various position counts and mounting options. The series is designed for robust card edge connections in demanding environments. The specific model number indicates the exact pin count and physical dimensions.

Edgeboard Connectors Replacement Considerations

Direct substitutes include other EDAC 305 series variants with matching 54 positions and 3.96 mm pitch. Cross-reference mechanical drawings to ensure identical panel mount dimensions and contact alignment.