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305-058-521-507 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 58POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-058-521-507 is a standard card edge connector from the 305 series, designed for panel mount applications. It features a dual-row configuration with 58 positions and a contact spacing of 0.156 inches (3.96 mm). The connector utilizes gold-plated copper alloy contacts with a half-beam termination type, suitable for solder pin end connections. It accommodates printed circuit boards with a nominal thickness of 0.062 inches (1.57 mm) and operates within a temperature range of -40°C to +105°C.
Verify the specific ordering suffix against official EDAC documentation to ensure correct contact plating and insulation color specifications. Confirm that the target application supports the required 0.062-inch nominal PCB thickness. Check current availability status as distribution may vary by region. Ensure compliance with RoHS3 requirements if mandated by project standards before finalizing procurement orders.
Select this component when a 58-position dual-row interface is required for vertical panel mounting. The 3.96 mm pitch defines the compatible card edge width. Consider the half-beam contact style for secure mating forces. Verify that the operating environment remains within the -40°C to +105°C thermal limits. Ensure the host system design aligns with the specified thermoplastic housing material properties.
This part belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts while maintaining consistent 0.156-inch spacing. The 305-058 variant specifically addresses higher density needs compared to lower-count models in the same family. It shares common mechanical dimensions with other series members differing only in contact quantity.
Direct substitutes include EDAC 305-050-521-507 and 305-058-521-504, provided position counts and suffix variations match application requirements. Cross-series replacements require verification of row spacing and board thickness compatibility. Ensure any alternative maintains the same dual-edge female configuration and solder pin termination style.
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