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305-074-521-204 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 74POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-074-521-204 is a standard card edge connector from the 305 Series, designed for panel mount applications. It features a dual row configuration with 74 positions and a contact spacing of 0.156 inches (3.96 mm). The connector utilizes gold-plated contacts on a copper alloy base, housed in a green thermoplastic polyester insulator. It supports PCB thicknesses ranging from 0.054 to 0.070 inches and operates within a temperature range of -40°C to +105°C.
Verify the specific ordering suffix against the manufacturer's official 305 Series Ordering Guide to confirm compatibility with required PCB thickness and mounting style. Ensure that the selected variant matches the intended application environment regarding temperature ratings and contact plating specifications before finalizing procurement orders.
Select this component when a dual-row, 74-position interface is required for panel-mounted assemblies. Consider the 0.156-inch pitch and compatible PCB thickness range during mechanical design. Evaluate the operating temperature limits and material composition to ensure suitability for the target electronic environment and regulatory compliance standards.
This part belongs to the EDAC 305 Series of standard card edge connectors, which are widely used in various electronic industries. The series offers multiple position counts and mounting options to accommodate diverse design requirements. The 305-074-521-204 specifically addresses needs for medium-density connections with standardized dimensions and reliable performance characteristics.
Consult the EDAC 305 Series cross-reference documentation for verified substitute part numbers. Ensure any replacement maintains identical pin count, pitch, and mounting configuration to guarantee mechanical and electrical compatibility without redesigning the host assembly.
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