SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 30807753 is a front panel accessory designed for VMEbus plug-in units. It features an aluminum construction with an anodized finish and is unshielded. The component adheres to the AI (Advanced Industry) form factor standard, specifically sized for 6U height and 10 Width HP. It utilizes a screw assembly method for secure mounting within compatible subracks or chassis systems.
Verify that the target application requires an unshielded panel, as this part does not provide electromagnetic interference protection. Confirm compatibility with the specific 6U x 10HP slot dimensions of the host chassis. Ensure the screw assembly pattern matches the existing mounting hardware in the enclosure to guarantee proper fit and mechanical stability during operation.
Select this component when an unshielded, anodized aluminum front panel is required for a 6U VMEbus module. It is appropriate for environments where EMI shielding is managed by other means or is unnecessary. Verify that the AI form factor aligns with the system architecture before procurement to ensure dimensional compatibility with the plug-in unit.
This part belongs to the nVent SCHROFF range of electronic packaging solutions. SCHROFF specializes in rack accessories and enclosures for industrial and telecommunications applications. The 30807753 serves as a structural interface element, providing a finished front face for internal circuit boards while maintaining alignment within the rack system.
No public confirmed substitute part numbers are available in the provided documentation.

Choose an AC to DC converter by input range, output demand, isolation, efficiency and thermal derating. Compare architectures and check installation needs.
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
Vishay Intertechnology, Inc., a global leader in discrete semiconductors and passive electronic components, has officially announced a price adjustment for its Metal-Oxide-Semiconductor Field-Effect Transistors…
Read More
Monolithic Power Systems (MPS), a global leader in analog and mixed-signal semiconductors, has notified its distribution partners of an upcoming price increase for selected…
Read More
Compare RC, crystal and MEMS oscillator circuits. Check ppm, jitter, load capacitance, startup margin and output compatibility before choosing a clock source.
Read More
Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More