SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF 30809700 is a rack mounting bracket designed for cassette integration. It belongs to the 30809 Series and functions as a cover plate or rear panel component. The unit is constructed from steel material, providing structural support for printed circuit board assemblies within rack frames. This accessory facilitates secure PCB mounting in bottom positions, ensuring stability for electronic modules in industrial enclosures.
Verify the manufacturer part number 30809700 against official nVent SCHROFF documentation to confirm compatibility with specific cassette models. Ensure the steel construction meets environmental requirements for the intended installation. Cross-reference technical datasheets for precise dimensional tolerances before procurement to avoid integration errors.
Select this bracket when integrating cassettes into standard rack frames requiring bottom-mounted PCB support. The steel composition offers robust mechanical stability compared to lighter alternatives. Confirm that the bracket dimensions align with the specific cassette series being utilized to ensure proper fitment within the enclosure structure.
This component is part of the nVent SCHROFF 30809 Series, which provides various accessories for rack mounting systems. It serves as a specialized hardware element for securing electronic modules, distinct from general chassis panels. The product falls under rack accessories, supporting structured cable management and module organization in industrial environments.
No public confirmed substitute part numbers are available in the provided documentation.

Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
The global electronics industry is facing an escalating shortage of tantalum capacitors, a critical passive component, as surging demand from AI servers, automotive electronics,…
Read More
The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More