SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF 30818289 is an unshielded aluminum front panel designed for 3U rack mounting systems. It features a height of 128.4 mm and a width of 106.3 mm, corresponding to 21 HP (Huttinger Pitch) compatibility. The component is constructed from aluminum material and complies with RoHS regulations. This specific part number identifies the physical dimensions and form factor required for integration into standard industrial enclosure frameworks.
Verify that the required mounting configuration matches the 3U standard and 21 HP width specification. Confirm that the unshielded design meets the electromagnetic interference requirements of the intended application environment. Ensure compliance with RoHS directives if applicable to the project specifications before finalizing procurement.
Select this component when a 3U height and 106.3 mm width are required for a rack-mounted assembly. The aluminum construction provides necessary rigidity for front panel applications. Consider the unshielded nature of the part when evaluating environmental protection needs against alternative shielded options within the same series.
This part belongs to the nVent SCHROFF 30818 Series, which comprises various aluminum front panels for box and rack accessories. The series offers multiple configurations differing in height, width, and shielding characteristics to accommodate diverse enclosure requirements within standardized industrial mounting frameworks.
Consult official nVent SCHROFF documentation for verified substitute part numbers within the 30818 series or compatible product lines. Cross-reference dimensional specifications and mounting hole patterns to ensure mechanical interchangeability without modifying existing enclosure structures.

Compare SPST and SPDT toggle switches, understand AC/DC ratings, and follow wiring examples. Check contact action, mounting and parts in the ChipApex catalog.
Read More
If you’ve spent any time staring at a schematic, you’ve seen the triangle. Two inputs, one output, and a gain symbol that looks deceptively…
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
Learn what an integrated circuit is, how ICs work, the main types and the specs to check before choosing a part for your design…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read MoreON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read More
Vishay Intertechnology, Inc., a global leader in discrete semiconductors and passive electronic components, has officially announced a price adjustment for its Metal-Oxide-Semiconductor Field-Effect Transistors…
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More