SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 30823257 is a CompacPRO front panel designed for 19-inch rack mounting systems. It features a 3U height and 42HP width, constructed from aluminum with an anodized grey finish. The component measures 480 x 88mm and includes necessary mounting hardware for secure attachment to the case front frame.
Verify RoHS compliance status through official manufacturer documentation before procurement. Confirm exact dimensional tolerances and surface finish specifications against project requirements. Ensure compatibility with existing rack frame standards. Check for any specific environmental classifications required by the application environment.
Select this part when a standard 3U, 42HP front panel is required for 19-inch racks. Consider the aluminum construction and anodized finish for durability and aesthetics. Verify that the included mounting hardware meets the specific torque and security needs of the installation.
This component belongs to the nVent SCHROFF CompacPRO series, a line of standardized electronics packaging solutions. The series provides modular accessories for building robust rack enclosures. The 30823257 specifically serves as a front closure element within this ecosystem.
No public confirmed substitute part numbers are available in the provided source data.

As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More
See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read MoreRecently, global semiconductor manufacturers have been constantly taking actions and presenting numerous new developments in aspects such as process technology and product research and…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More