SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 30838125 is a partial front panel from the 30838 Series, designed for 6U rack applications. It features a 5HP width and measures 261.8 mm in height with a depth of 25 mm. Constructed from aluminum, the component offers an anodized exterior surface for durability and a conductive rear side to ensure electrical conductivity. This unshielded design serves as a structural enclosure accessory for electronic equipment integration.
Verify the exact dimensional requirements against your chassis specifications before ordering. Confirm that the 5HP width and 6U height align with your existing rack infrastructure. Ensure the unshielded nature meets your electromagnetic compatibility needs. Check for any specific surface finish requirements beyond the standard anodized coating.
Select this part when a partial front panel solution is required for 6U racks. The 5HP dimension dictates its compatibility with specific module widths. Consider the conductive rear property if grounding through the panel is necessary. Evaluate the need for shielding; this model is unshielded, so additional measures may be required for EMI protection.
This component belongs to the nVent SCHROFF 30838 Series of aluminum front panels. These panels are widely used in industrial electronics packaging. The series offers various dimensions and configurations to suit different rack standards. The 30838125 specifically addresses the 6U/5HP configuration within this extensive product line.
No public confirmed substitute part numbers are available in the provided documentation.

Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More
The global electronics industry is facing an escalating shortage of tantalum capacitors, a critical passive component, as surging demand from AI servers, automotive electronics,…
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
Selecting the right microcontroller (MCU) isn’t just about specs—it’s about balancing performance, power, cost, and supply chain reliability. As an engineer, you’ve probably faced…
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
See when an inductor behaves linearly, how DC bias and saturation reduce inductance, and which current and temperature curves to check.
Read More
Monolithic Power Systems (MPS), a global leader in analog and mixed-signal semiconductors, has notified its distribution partners of an upcoming price increase for selected…
Read More
If you’ve spent any time staring at a schematic, you’ve seen the triangle. Two inputs, one output, and a gain symbol that looks deceptively…
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More