SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 30849407 is a stainless steel front panel designed for Advanced MC (AMC) modules, complying with PICMG AMC.0 R2.0 specifications. It features a double full-size configuration with a width of 29 mm and a height of 148.8 mm. The unit includes a pull-handle mechanism with necessary cut-outs and has a depth of 1 mm. This component provides structural support and interface access for high-performance computing applications within standard rack enclosures.
Verify the specific material grade and surface finish requirements against your environmental standards. Confirm that the pull-handle cut-out dimensions align with your chosen actuator components. Ensure compatibility with the target rack enclosure's mounting hole patterns before finalizing procurement orders.
Select this part when a robust, metal front panel is required for double full-size AMC modules. The stainless steel construction offers superior mechanical strength compared to aluminum alternatives. Consider the integrated handle design if frequent module insertion and removal are anticipated in the deployment environment.
This component belongs to the nVent SCHROFF Advanced MC product line, which specializes in packaging solutions for modular computing architectures. The series supports various form factors and materials to meet diverse industrial and commercial electronics packaging needs.
Check for equivalent parts such as 30849658 if an aluminum single mid-size variant is acceptable. Verify dimensional compatibility with existing rack structures before substituting.
It complies with the PICMG AMC.0 R2.0 specification for Advanced MC modules.
No, it is designed for double full-size configurations only.

Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read MoreRecently, global semiconductor manufacturers have been constantly taking actions and presenting numerous new developments in aspects such as process technology and product research and…
Read MoreON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read More