335-10-103-00-160000

Headers, Male Pins Overview

The Mill-Max 335-10-103-00-160000 is a low-profile interconnect socket designed for board-to-board applications. It features a 3-position header configuration with a 0.100-inch (2.54mm) spacing. The component utilizes through-hole termination and includes a push-pull mounting style for secure attachment. Contact materials are constructed from beryllium copper, ensuring durability and conductivity.

Headers, Male Pins Feature Summary

• Low-profile design minimizes vertical interconnect height
• Push-pull mounting style ensures secure mechanical retention
• Through-hole termination method for PCB integration

Headers, Male Pins Applications

• Board-to-board interconnections
• Compact electronic assemblies requiring minimal height
• Precision-machined interconnect components

Headers, Male Pins Procurement Notes

Verify the specific pin count and series designation against official Mill-Max documentation to ensure compatibility with target PCB layouts. Confirm that the through-hole termination and push-pull mounting requirements align with assembly processes. Cross-reference datasheet tolerances for critical spatial constraints.

Headers, Male Pins Selection Notes

Select this component when reduced vertical profile is required for dense circuit board arrangements. Evaluate the 0.100-inch pitch against mating connector specifications. Ensure the through-hole installation method suits the manufacturing capabilities and that the push-pull feature meets mechanical retention needs.

Headers, Male Pins Part Context

This part belongs to the Mill-Max 335 series of low-profile interconnect sockets. These components are engineered for high-reliability applications where space efficiency is paramount. The series is characterized by precision machining and robust contact materials suitable for demanding electronic environments.

Headers, Male Pins Replacement Considerations

Direct substitutes within the same series or family should be considered if pin counts differ. Verify that alternative parts maintain identical spacing, termination type, and mounting style to ensure functional equivalence without redesigning the host board.