SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 34812-210 is a rear panel designed for frame-type plug-in units. It features a height of 3 HE and a width of 10 TE. The unit has a depth of 160 mm. This component serves as a structural backplane for modular electronic enclosures, providing mounting support and alignment for associated hardware within the system architecture.
Verify the exact part number 34812-210 against official nVent SCHROFF documentation to ensure compatibility with your specific frame system. Confirm that the 3 HE height and 10 TE width dimensions match your enclosure requirements. Check for any specific ordering suffixes or variations in the manufacturer's current catalog before placing orders.
Select this rear panel when integrating frame-type plug-in units requiring a 3 HE by 10 TE footprint. Ensure the 160 mm depth aligns with the overall chassis constraints. Verify that the mounting interface matches the specific Schroff frame series being utilized in the design.
This component belongs to the nVent SCHROFF range of accessories for printed circuit board and plug-in unit systems. It functions as a complementary element to front panels and card retainers, completing the mechanical structure for standardized rack-mounted equipment installations.
Consult the official nVent SCHROFF cross-reference list for verified substitutes. Generic equivalents may not maintain the precise 3 HE and 10 TE dimensional tolerances required for frame-type plug-in unit integration.
The Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More
Learn how a diode conducts, how to identify anode and cathode, and when to choose rectifier, TVS, Zener or photodiode types for a circuit.
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More