350-10-120-00-106000

Headers, Male Pins Overview

The Mill-Max 350-10-120-00-106000 is a precision-machined interconnect header designed for surface mount applications. It features a single row configuration with twenty positions and a standard 2.54mm pitch. The component utilizes gold-plated contacts to ensure reliable signal transmission in board-to-board connections. This specific part number represents a fixed-height header intended for direct soldering onto printed circuit boards, providing stable mechanical support and electrical continuity within compact electronic assemblies.

Headers, Male Pins Feature Summary

• Precision-machined construction for high reliability
• Surface mount technology (SMT) compatibility
• Gold-plated contact surfaces for corrosion resistance
• Single-row board-to-board interconnect design

Headers, Male Pins Applications

• Board-to-board interconnect systems
• High-density electronic assembly modules
• Precision instrumentation interfaces

Headers, Male Pins Procurement Notes

Verify the exact pin count and mounting style against the official datasheet before ordering. Confirm that the surface mount footprint matches the target PCB layout. Ensure compliance with RoHS directives if required by the end product specifications. Cross-reference the manufacturer part number to avoid confusion with similar series variants.

Headers, Male Pins Selection Notes

Select this component when a low-profile, single-row surface mount header is required for board-to-board connections. Consider the 2.54mm pitch for standard spacing requirements. Evaluate the need for gold plating versus tin plating based on environmental conditions and mating cycle expectations. Ensure the SMT package aligns with available automated placement equipment capabilities.

Headers, Male Pins Part Context

This component belongs to the Mill-Max 350 series of machined pin headers. The series is known for offering customizable lengths and configurations while maintaining high manufacturing standards. As a surface mount variant, it differs from through-hole counterparts by eliminating the need for hole drilling, thereby supporting modern high-volume PCB assembly processes.