350-40-156-00-001000

Headers, Male Pins Overview

The Mill-Max 350-40-156-00-001000 is a vertical pin header connector designed for through-hole mounting. It features 56 positions arranged in a dual-row configuration with a 0.100-inch (2.54mm) pitch. The contacts are tin-plated copper alloy pins, providing reliable electrical connectivity. This component belongs to the standard pin header series and utilizes a turret head design for secure termination.

Headers, Male Pins Feature Summary

• Vertical orientation for board-to-board or cable connections
• Through-hole solder tail termination style
• Tin-plated contact surfaces for corrosion resistance
• Standard 0.100 inch grid spacing

Headers, Male Pins Applications

• General purpose electronic interconnects
• Industrial control panel wiring
• Test and measurement equipment interfaces
• Consumer electronics assembly

Headers, Male Pins Procurement Notes

Verify the specific plating thickness and material composition against the official datasheet before integration. Confirm that the through-hole footprint matches the target PCB layout dimensions. Ensure compatibility with standard reflow or wave soldering processes used in your manufacturing line.

Headers, Male Pins Selection Notes

Select this part when a high-density vertical connection is required. The 56-position count supports complex signal routing. Verify that the operating temperature range meets system requirements. Consider mechanical stability needs for the chosen mounting environment.

Headers, Male Pins Part Context

This component is part of Mill-Max's extensive catalog of precision interconnect solutions. It serves as a male pin header variant within the rectangular connector family. The design prioritizes durability and consistent electrical performance across various industrial applications.

Headers, Male Pins Replacement Considerations

Check for direct substitutes within the same series offering different row counts or termination styles. Ensure any alternative maintains the 2.54mm pitch and vertical form factor. Verify cross-compatibility with existing mating connectors.