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387-084-559-201 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 84POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 387-084-559-201 is a standard card edge connector from the 387 series, designed for dual-edge board insertion. It features 84 positions with a 3.96 mm (0.156 inch) contact spacing and supports PCB thicknesses ranging from 1.37 mm to 1.78 mm. The connector utilizes gold-plated copper alloy contacts rated for 3 A current and offers an insulation resistance of 5 GOhms. Constructed with a thermoplastic polyester housing, it operates within a temperature range of -40°C to +105°C.
Verify the specific part number against official manufacturer documentation to confirm compatibility with target PCB specifications. Ensure that the required PCB thickness falls within the supported range of 1.37 mm to 1.78 mm. Confirm that the application environment remains within the specified operating temperature limits of -40°C to +105°C to maintain electrical performance integrity.
Select this component when a high-density connection with 84 positions is required for dual-edge card applications. The 3.96 mm pitch accommodates standard board layouts while maintaining robust mechanical engagement. Consider the through-hole termination method and vertical mounting orientation during circuit board layout planning to ensure proper physical alignment and solder joint reliability.
This connector belongs to the EDAC 387 series, which specializes in standard card edge solutions. The series is characterized by its consistent 3.96 mm spacing and durable construction materials. This specific model represents a high-pin-count variant suitable for complex signal routing requirements in professional electronic assemblies.
Cross-reference with other EDAC 387 series variants sharing identical pin counts and spacing. Verify mechanical dimensions and termination styles before substituting with generic equivalents to ensure functional compatibility.
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