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399-41-035-21-300000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is STANDARD SOCKET HEADER. Review the specifications below when checking this part for your BOM.
The Mill-Max 399-41-035-21-300000 is a spring-loaded PCB target connector designed for in-circuit testing applications. It features a 35-position single-row configuration with a 0.100-inch (2.54mm) pitch. The component utilizes brass alloy contacts with a gold finish to ensure reliable electrical performance. It supports through-hole mounting and right-angle orientation on the printed circuit board, providing stable contact for test probes during manufacturing verification processes.
Verify that the specific ordering suffix matches the required pin count and termination style. Confirm compatibility with standard pogo pin probe diameters used in existing test fixtures. Ensure the right-angle mounting orientation aligns with the mechanical constraints of the assembly design before finalizing procurement orders.
Select this component when a single-row, high-density target array is required for vertical probe access. The 2.54mm pitch suits standard board layouts. Consider the right-angle form factor for space-constrained designs where probe access is from above. Validate that the gold plating thickness meets the endurance requirements of the specific test cycle frequency.
This part belongs to the Mill-Max 399 series of spring targets, which are passive interconnect components used exclusively as mating points for active pogo pins. Unlike active connectors, these targets do not generate signals but provide a durable, low-resistance interface for automated test equipment to monitor circuit parameters during production.
Direct substitutes must match the 35-position count, 2.54mm pitch, and right-angle through-hole mounting. Verify that alternative spring targets maintain identical contact geometry and plating specifications to ensure probe compatibility and long-term durability in high-cycle test environments.
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