410-43-242-61-105000

Description：CONN RCPT 42POS 0.1 GOLD SMD
Series：410
Mfr：Mill-Max Manufacturing Corp.
Package：Bulk

SKU:6d8f83c2a378 Category: Headers, Receptacles, Female Sockets Brand: Mill-Max Manufacturing Corp.

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Product introduction

410-43-242-61-105000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 42POS 0.1 GOLD SMD. Review the specifications below when checking this part for your BOM.

Headers, Receptacles, Female Sockets specifications for 410-43-242-61-105000

Description：CONN RCPT 42POS 0.1 GOLD SMD
Series：410
Mfr：Mill-Max Manufacturing Corp.
Package：Bulk
Connector Type：Receptacle
Contact Type：Female Socket
Style：Board to Board
Number of Positions：42
Number of Positions Loaded：All
Pitch - Mating：0.100" (2.54mm)
Number of Rows：2
Row Spacing - Mating：0.100" (2.54mm)
Mounting Type：Surface Mount
Termination：Solder
Fastening Type：Push-Pull
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：30.0µin (0.76µm)
Insulation Color：Black
Insulation Height：0.220" (5.60mm)
Contact Length - Post：-
Operating Temperature：-55°C ~ 125°C
Material Flammability Rating：-
Contact Finish - Post：Tin
Mated Stacking Heights：-
Ingress Protection：-
Features：-
Current Rating (Amps)：3A
Voltage Rating：-

Headers, Receptacles, Female Sockets datasheet and documents for 410-43-242-61-105000

410-43-242-61-105000

Headers, Receptacles, Female Sockets Overview

The Mill-Max 410-43-242-61-105000 is a precision machined interconnect component designed for high-reliability applications. It features a header configuration with 42 positions arranged in a single row, utilizing a 0.100-inch (2.54 mm) centerline spacing. The connector employs through-hole termination for secure PCB mounting and includes gold-plated contacts to ensure consistent signal integrity. This specific part number represents a standard industrial solution within the Mill-Max portfolio, engineered for stable electrical performance in demanding environments.

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