410-93-216-41-105000

$16.16

Description：CONN RCPT 16POS 0.1 GOLD SMD
Series：410
Mfr：Mill-Max Manufacturing Corp.
Package：Tube

SKU:07cb976ee29a Category: Headers, Receptacles, Female Sockets Brand: Mill-Max Manufacturing Corp.

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Product introduction

410-93-216-41-105000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 16POS 0.1 GOLD SMD. Review the specifications below when checking this part for your BOM.

Headers, Receptacles, Female Sockets specifications for 410-93-216-41-105000

Description：CONN RCPT 16POS 0.1 GOLD SMD
Series：410
Mfr：Mill-Max Manufacturing Corp.
Package：Tube
Connector Type：Receptacle
Contact Type：Female Socket
Style：Board to Board
Number of Positions：16
Number of Positions Loaded：All
Pitch - Mating：0.100" (2.54mm)
Number of Rows：2
Row Spacing - Mating：0.100" (2.54mm)
Mounting Type：Surface Mount
Termination：Solder
Fastening Type：Push-Pull
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：30.0µin (0.76µm)
Insulation Color：Black
Insulation Height：0.220" (5.60mm)
Contact Length - Post：-
Operating Temperature：-55°C ~ 125°C
Material Flammability Rating：-
Contact Finish - Post：Tin-Lead
Mated Stacking Heights：-
Ingress Protection：-
Features：-
Current Rating (Amps)：3A
Voltage Rating：-

Headers, Receptacles, Female Sockets datasheet and documents for 410-93-216-41-105000

410-93-216-41-105000

Headers, Receptacles, Female Sockets Overview

The Mill-Max Manufacturing Corp. model 410-93-216-41-105000 is a standard pin receptacle connector designed for through-hole mounting on printed circuit boards. This component features a single row of sixteen contacts with a center-to-center spacing of 0.100 inches (2.54 mm). The contact pins are constructed from beryllium copper and feature a gold plating over a nickel barrier to ensure reliable electrical conductivity and corrosion resistance. The unit is engineered for vertical mating applications, providing a secure mechanical interface for signal transmission in electronic assemblies.

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