415-41-216-41-001000

Headers, Receptacles, Female Sockets Overview

The Mill-Max 415-41-216-41-001000 is a single in-line package (SIP) IC socket designed for through-hole mounting. It features 16 positions with a 0.100-inch (2.54mm) contact spacing. The contacts are constructed from copper alloy and finished with gold plating to ensure reliable signal transmission. This component utilizes standard solder tail termination for secure PCB attachment.

Headers, Receptacles, Female Sockets Feature Summary

• Single in-line configuration for compact circuit integration
• Gold-plated contacts for enhanced conductivity and corrosion resistance
• Standard solder tail termination for robust through-hole assembly

Headers, Receptacles, Female Sockets Applications

• Single in-line memory module sockets
• Logic gate and amplifier IC interfaces
• General-purpose digital circuit prototyping

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific series designation and pin count against the official Mill-Max datasheet before procurement. Confirm that the gold plating thickness and contact material specifications meet the required environmental and electrical standards for the target application. Ensure compatibility with the intended DIP package dimensions.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a single-row interface is required for SIP packages. Consider the through-hole mounting style and solder tail termination method for mechanical stability. Evaluate the operating temperature range and current rating requirements to ensure the copper alloy construction provides sufficient performance for the specific load conditions.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the Mill-Max 415 series of IC and component sockets. The series is characterized by standard solder tail designs suitable for through-hole applications. It serves as a reusable interface between integrated circuits and printed circuit boards, facilitating component replacement and testing within electronic assemblies.