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415-47-246-41-004000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is STANDRD SOLDER TAIL SIP SOCKET. Review the specifications below when checking this part for your BOM.
The Mill-Max 415-47-246-41-004000 is a low-profile socket connector designed for through-hole mounting. It features 46 positions with a double-row configuration and a 0.100-inch (2.54mm) pitch. The contacts are gold-plated to ensure reliable signal transmission. This component accepts leads with diameters ranging from 0.015 inches to 0.022 inches (0.381mm to 0.559mm). The housing provides an above-board height of approximately 2.11mm, facilitating compact board-to-board or device connections in space-constrained applications.
Verify that the target application supports through-hole soldering processes. Confirm that the mating components utilize leads within the specified 0.015-inch to 0.022-inch diameter range. Ensure the PCB layout accommodates the double-row pinout and the specific 2.11mm height constraint. Check for any environmental requirements regarding gold plating durability.
Select this component when a low-profile socket is required for double-row connections. It is suitable for applications where standard-height sockets exceed available vertical clearance. The gold plating makes it appropriate for environments requiring robust contact reliability. Consider the 0.100-inch pitch compatibility with existing board designs before finalizing the selection.
This part belongs to the Mill-Max 415 series of low-profile sockets. The series is characterized by machined pin construction and solder tail terminations. It is designed for high-reliability applications where precise alignment and consistent electrical performance are critical. The 415 series offers various position counts and row configurations to suit different density requirements.
Direct substitutes must match the 46-position count, double-row layout, and 0.100-inch pitch. Verify that alternative parts support the same lead diameter range and offer comparable gold plating thickness. Ensure the replacement maintains the low-profile form factor to fit within the existing enclosure constraints.
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