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416-91-254-41-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN SOCKET 54POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 416-91-254-41-001000 is a single in-line package (SIP) socket designed for through-hole mounting. It features 54 positions with a 0.100-inch (2.54mm) contact pitch and row spacing. The contacts are gold-plated copper alloy, providing reliable interconnection. The unit utilizes standard solder tail termination for secure PCB attachment. This component serves as an interface between integrated circuits and printed circuit boards, supporting standard DIP configurations.
Verify the specific pin count and row spacing against the target IC footprint before ordering. Confirm that the solder tail termination method aligns with the assembly process capabilities of the manufacturing line. Ensure the gold plating specification meets the required environmental durability standards for the intended application environment.
Select this part when a single-row SIP socket is required for high-pin-count applications. Compare against dual-in-line options if space allows for wider footprints. Consider the mechanical height constraints of the enclosure to ensure the socket profile fits within the design limits without interference from adjacent components or covers.
This component belongs to the Mill-Max 416 series of precision machined interconnects. The series offers various pin counts and termination styles to accommodate different IC packages. Mill-Max Manufacturing Corp. specializes in high-reliability connectors for demanding electronic environments, ensuring consistent performance across their product lines.
Direct substitutes include other 54-position SIP sockets with identical 0.100-inch pitch and solder tail termination. Verify compatibility with existing board layouts and tooling before switching manufacturers. Ensure the replacement maintains the same contact material and plating thickness specifications.
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