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453-10-230-00-001000 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN HEADER VERT 30POS 2.54MM. Review the specifications below when checking this part for your BOM.
The Mill-Max 453-10-230-00-001000 is a standard pin header connector designed for through-hole mounting. It features 30 positions arranged in a single row with a 0.100-inch (2.54 mm) contact spacing. The component utilizes gold-plated contacts to ensure reliable signal transmission and low contact resistance. This header is engineered for secure board-to-board or cable-to-board interconnections, providing a robust mechanical connection suitable for various electronic assembly requirements.
Verify the specific contact plating thickness and material composition against the official Mill-Max datasheet before finalizing procurement decisions. Confirm that the through-hole footprint dimensions align precisely with your printed circuit board design constraints. Ensure compatibility with standard soldering profiles to maintain joint integrity during assembly processes.
Select this component when a single-row, 30-position header is required for high-reliability applications. The 2.54 mm pitch ensures compatibility with standard ribbon cables and mating connectors. Consider the gold plating for environments requiring long-term stability and minimal oxidation effects on contact surfaces.
This part belongs to the Mill-Max 453 series of standard pin headers. The series offers various position counts and row configurations to support diverse interconnection needs. These components are widely used in industrial and commercial electronics where dependable electrical connections are critical for system performance and longevity.
Direct substitutes must match the 30-position count, single-row arrangement, and 2.54 mm pitch. Verify that alternative headers provide equivalent through-hole termination methods and compatible gold plating specifications to ensure functional interchangeability without redesigning the host PCB.
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