7-146259-5

Overview

The 7-146259-5 is a vertical, breakaway header connector from the AMPMODU Mod II series manufactured by TE Connectivity. It features 50 positions with a 0.100-inch (2.54mm) pitch. The connector utilizes gold-plated contacts for reliable signal transmission and tin-plated tails for soldering to printed circuit boards. Designed for through-hole mounting, this single-row component provides a secure interconnection solution for electronic assemblies requiring high-density pin configurations.

Feature Summary

• Vertical orientation facilitates compact board layout integration
• Breakaway design allows for flexible row length customization
• Gold contact plating ensures durable electrical conductivity

Applications

• General purpose electronic equipment interconnects
• Industrial control system signal routing
• Consumer electronics assembly

Procurement Notes

Verify the specific position count and termination style against the official datasheet before ordering. Confirm that the lead-free and RoHS compliance status matches project requirements. Ensure the breakaway feature aligns with the manufacturing process for customizing row lengths on the target PCB.

Selection Notes

Select this component when a high-density, single-row male header is required for vertical mounting. The 2.54mm pitch is standard for general-purpose applications. Consider the breakaway capability if variable row lengths are needed across different production batches or prototypes.

Part Context

This part belongs to the AMPMODU Mod II family, a widely used interconnection system known for reliability in harsh environments. The series offers various configurations including headers, housings, and terminals, supporting both wire-to-board and board-to-board connections within the same ecosystem.

Replacement Considerations

Compatible substitutes include other 50-position, 2.54mm pitch vertical headers from the same manufacturer. Verify mechanical dimensions and contact material specifications to ensure interchangeability without redesigning the host PCB footprint.