71T75602S133PFG8

Memory IC Overview

The 71T75602S133PFG8 is a synchronous Single Data Rate Zero Bus Turnaround SRAM IC manufactured by Renesas Electronics. It provides an 18Mb storage capacity organized as 512K words by 36 bits. The device supports parallel interface operations with a maximum clock frequency of 133 MHz and features a typical access time of 4.2 ns. It operates within a supply voltage range of 2.375V to 2.625V and is housed in a 100-TQFP (14x14) surface-mount package.

Memory IC Feature Summary

• Supports Zero Bus Turnaround (ZBT) technology for efficient data transfer
• Utilizes a 2.5V core voltage architecture for power efficiency
• Features synchronous operation aligned with system clock signals

Memory IC Applications

• High-speed digital signal processing systems
• Network infrastructure equipment requiring low-latency buffering
• Embedded systems utilizing wide data buses

Memory IC Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm the specific suffix PFG8 matches the required 100-TQFP packaging and lead-free specifications. Check current lifecycle status as availability may vary due to production schedules. Ensure compliance with RoHS directives if applicable to your region. Validate moisture sensitivity level handling requirements during assembly.

Memory IC Selection Notes

Select this part when a 36-bit wide data interface is required for memory buffering. Compare against other members of the 71T75602 series for variations in speed grades or packaging options. Consider the 133 MHz performance limit relative to your system clock requirements. Evaluate thermal dissipation needs for the TQFP-100 package in enclosed designs.

Memory IC Part Context

This component belongs to the Renesas 71T75602 family of high-performance synchronous SRAMs. It shares architectural similarities with variants like the 71T75602S133PFGI but differs in packaging and trailing suffix designations. The family is designed for applications demanding fast random access and wide data paths in embedded environments.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing PCB footprints and electrical characteristics before considering alternative sources.