71V2556SA100BGI

Memory IC Overview

The 71V2556SA100BGI is a 4.5 Mbit synchronous static random-access memory (SRAM) manufactured by Renesas Electronics Corporation. Organized as 128K x 36, it utilizes Zero Bus Turnaround (ZBT) technology to eliminate dead bus cycles during read-write transitions. The device operates with a 3.3V core supply and 2.5V I/O supply, supporting a maximum clock frequency of 100 MHz with a 5 ns access time. It is housed in a 119-pin plastic ball grid array (PBGA) package measuring 14x22 mm and functions within an industrial temperature range of -40°C to +85°C.

Memory IC Feature Summary

• Zero Bus Turnaround (ZBT) architecture eliminates dead bus cycles between read and write operations.
• Synchronous Single Data Rate (SDR) pipelined interface for high-speed data transfer.
• Integrated address and control signal registers to support four cycles of data per single address presentation.

Memory IC Applications

• High-performance processor secondary cache systems
• Network infrastructure equipment requiring low-latency buffering
• Industrial control systems demanding reliable synchronous memory

Memory IC Procurement Notes

Verify component authenticity through authorized channels due to end-of-life status. Confirm RoHS compliance requirements as the part may not meet current environmental standards. Validate package dimensions against PCB footprint specifications before integration. Check for moisture sensitivity level handling procedures during assembly.

Memory IC Selection Notes

Select this component for applications requiring ZBT performance with 36-bit data width. Ensure system design supports 3.3V core and 2.5V I/O voltage domains. Verify that the 119-pin PBGA package fits the available board space and thermal constraints. Consider the 100 MHz operational limit when designing clock distribution networks.

Memory IC Part Context

This part belongs to the 71V2556 family of ZBT synchronous SRAMs. It shares architectural similarities with other variants in the series but differs in speed grade and packaging. The BGI suffix denotes the specific 119-pin PBGA package configuration suitable for surface-mount assembly in dense electronic designs.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. The product status is listed as End-of-Life (EOL). Designers should consult official Renesas resources for potential obsolescence management strategies or alternative family members with compatible pinouts.