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71V321SA35PF8 is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 16KBIT PARALLEL 64TQFP. Review the specifications below when checking this part for your BOM.
The Renesas Electronics Corporation 71V321SA35PF8 is a high-speed, dual-port static random-access memory (SRAM) device organized as 2K x 8 bits, providing a total storage capacity of 16 kilobits. It operates asynchronously with a maximum access time of 35 nanoseconds and supports a supply voltage range of 3.0 volts to 3.6 volts. The component utilizes a parallel interface for data transfer and is housed in a 64-pin Thin Quad Flat Package (TQFP) with dimensions of 14x14 millimeters. Designed for surface-mount installation, it functions within an industrial temperature range of -40°C to +85°C.
Verify the exact suffix configuration against official Renesas documentation to confirm pinout compatibility and electrical specifications. Confirm RoHS compliance status and moisture sensitivity level requirements prior to integration. Ensure the selected package variant matches the target PCB footprint and thermal management design constraints.
Select this component when a system requires asynchronous dual-port SRAM with a 16-kilobit capacity and 35-nanosecond access speed. It is suitable for applications needing independent port access within a 3-volt to 3.6-volt power domain. Consider the 64-pin TQFP package for surface-mount assembly needs in industrial temperature environments.
This part belongs to the IDT 71V321 series of high-speed dual-port SRAMs manufactured by Renesas Electronics. The series is characterized by internal interrupt logic designed specifically for efficient interprocessor communications. These devices provide a reliable solution for buffering data between multiple processors or controllers in complex electronic systems.
Consult official manufacturer substitution lists for verified equivalents. Cross-reference technical parameters such as access time, voltage range, and package dimensions before considering alternative components.
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