Memory IC 71V35761SA166BGG product image

71V35761SA166BGG

$8.13
  • Description:IC SRAM 4.5MBIT PAR 119PBGA
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray

SKU:6b2e0b3ab75d Category: Brand:

  
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71V35761SA166BGG is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 4.5MBIT PAR 119PBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for 71V35761SA166BGG

  • Description:IC SRAM 4.5MBIT PAR 119PBGA
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, SDR
  • Memory Size:4.5Mbit
  • Memory Organization:128K x 36
  • Memory Interface:Parallel
  • Clock Frequency:166 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:3.135V ~ 3.465V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:119-BGA
  • Supplier Device Package:119-PBGA (14x22)
  • Access Time:3.5 ns

Memory IC datasheet and documents for 71V35761SA166BGG

71V35761SA166BGG

Memory IC Overview

The 71V35761SA166BGG is a 4.5 Mbit synchronous single data rate static random-access memory (SRAM) manufactured by Renesas Electronics Corporation. It features a parallel interface with a memory organization of 128K x 36 bits. The device supports a maximum clock frequency of 166 MHz and offers an access time of 3.5 ns. It operates within a supply voltage range of 3.135 V to 3.465 V and is designed for surface mount installation in a 119-pin plastic ball grid array (PBGA) package measuring 14x22 mm. The component is rated for an operating temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports high-speed parallel data transfer via a synchronous single data rate interface architecture.
  • Integrates pipelined burst mode functionality for efficient sequential data access operations.
  • Utilizes a 119-pin PBGA surface-mount package optimized for compact board space utilization.

Memory IC Applications

  • High-performance networking equipment requiring fast buffer memory
  • Telecommunications infrastructure systems
  • Industrial control systems demanding reliable volatile storage

Memory IC Procurement Notes

Verify the specific suffix BGG against official Renesas documentation to confirm the exact package dimensions and pinout configuration. Confirm RoHS compliance status as manufacturing changes may affect environmental certifications. Check current product lifecycle status, as this component may be subject to end-of-life notices or obsolescence warnings from the manufacturer.

Memory IC Selection Notes

Select this component when a 128K x 36 bit organization is required for wide data bus applications. Ensure the design accommodates the 3.3 V nominal supply voltage and the thermal requirements of the PBGA package. Verify that the system clock does not exceed 166 MHz to maintain signal integrity and timing specifications.

Memory IC Part Context

This part belongs to the 71V35761S family of synchronous SRAMs. It shares core architectural features with other variants in the series but differs in speed grade and physical packaging. The 'SA' designation typically indicates specific performance characteristics within the broader IDT/Renesas SRAM portfolio.

Memory IC Replacement Considerations

Consult official substitution guides for equivalent parts such as the 71V35761SA166BQGI if package compatibility allows. Verify electrical parameters and pin assignments before replacing to ensure functional equivalence.

71V35761SA166BGG71V35761SA166BGG
$8.13
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