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74ACT563PC is listed in the Latches range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is IC D-TYPE TRANSP SGL 8:8 20DIP. Review the specifications below when checking this part for your BOM.
The Fairchild Semiconductor 74ACT563PC is an octal D-type transparent latch housed in a 20-pin Plastic Dual-In-Line (PDIP) package. It operates within a supply voltage range of 4.5V to 5.5V and supports through-hole mounting. The device features tri-state outputs with inverted polarity, providing high-level output current of 24mA and low-level output current of 24mA. It exhibits a propagation delay of 7ns and functions reliably across an operating temperature range of -40°C to +85°C.
Verify the specific manufacturer designation, as Fairchild Semiconductor's logic division was acquired by onsemi. Confirm that the component matches the original Fairchild specifications rather than subsequent onsemi revisions. Ensure the PDIP-20 package type and lead finish are compatible with your assembly process. Check RoHS compliance status if required for your manufacturing standards.
Select this component when an octal latch with tri-state outputs and inverted polarity is required. It is suitable for applications needing TTL-compatible inputs and moderate speed performance with a 7ns propagation delay. Consider the PDIP-20 package for through-hole prototyping or legacy board designs. Evaluate power consumption and thermal requirements against the specified operating temperature range.
This part belongs to the 74ACT series of advanced CMOS logic devices, offering high-speed operation comparable to TTL while maintaining CMOS low power characteristics. The 74ACT563 specifically provides octal latching functionality, distinguishing it from non-latching buffers or flip-flops within the same family. It serves as a key component for data retention and synchronization in digital logic circuits.
The SN74ACT563N from Texas Instruments is a confirmed functional substitute with identical logical operations and pinout. Verify package compatibility, as the TI version may be available in different form factors. Ensure electrical parameters such as propagation delay and output current meet the design requirements.
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