895-029-559-101

Edgeboard Connectors Overview

The EDAC Inc. 895-029-559-101 is a standard card edge connector designed for single-row applications. It features 29 positions with a 0.100 inch (2.54mm) contact spacing. The connector utilizes female contacts with gold plating and is constructed from black insulating material. It supports a board thickness of 1.57mm and operates within a temperature range of -40°C to +125°C.

Edgeboard Connectors Feature Summary

• Single row configuration with 29 female positions
• Gold-plated contacts for reliable signal transmission
• Through-hole right-angle mounting for secure installation

Edgeboard Connectors Applications

• Industrial control systems
• Communication equipment
• Consumer electronics

Edgeboard Connectors Procurement Notes

Verify the specific ordering suffix against official EDAC documentation to ensure correct pin count, pitch, and termination style. Confirm that the target application requires a single-row interface and compatible board thickness before procurement. Cross-reference the manufacturer part number with authorized distributors to avoid counterfeit components.

Edgeboard Connectors Selection Notes

Select this component when a single-row connection is required with 29 positions. Ensure the PCB design accommodates the 0.100 inch pitch and through-hole right-angle footprint. Verify that the operating environment falls within the specified temperature range and that the board thickness matches the connector's tolerance.

Edgeboard Connectors Part Context

This component belongs to the EDAC 895 series of standard card edge connectors. The series offers various configurations for different industry needs. The 895-029-559-101 specifically addresses requirements for single-row connections with gold-plated contacts and through-hole termination.

Edgeboard Connectors Replacement Considerations

Consult official EDAC substitution guides for verified alternatives. Generic equivalents may not match the precise mechanical dimensions or contact plating specifications required for reliable performance in critical applications.