A-SL200-DA-G70MP1

Headers, Male Pins Overview

The A-SL200-DA-G70MP1 is a surface mount header connector manufactured by Assmann WSW Components. It features a right-angle configuration with 70 positions and a 2.00mm pitch. The component utilizes gold flash plating for reliable electrical contact. Designed for single-row applications, it offers a profile height of 0.079 inches (2.00mm) from the mounting surface. This connector supports automated assembly processes suitable for high-volume PCB integration.

Headers, Male Pins Feature Summary

• Right-angle surface mount design for compact vertical board connections
• Gold flash plating ensures durable signal transmission
• Single-row configuration simplifies layout routing

Headers, Male Pins Applications

• High-density electronic circuit boards
• Industrial control system interfaces
• Consumer electronics internal connections

Headers, Male Pins Procurement Notes

Verify that the specific suffix MP1 aligns with your manufacturing requirements. Confirm the 70-position count matches your design specifications. Ensure the right-angle orientation fits within your enclosure constraints. Validate the surface mount footprint against your PCB library before finalizing orders.

Headers, Male Pins Selection Notes

Choose this model when space efficiency is critical due to its right-angle form factor. The 2.00mm pitch provides a balance between density and manufacturability. Gold plating is preferred for environments requiring corrosion resistance. Consider the single-row limitation if higher pin counts are needed.

Headers, Male Pins Part Context

This component belongs to Assmann WSW's standard connector portfolio. The company specializes in IC sockets and IDC connectors. The A-SL series represents their surface mount header offerings. These components are engineered for reliability in mass production environments.

Headers, Male Pins Replacement Considerations

Cross-reference compatible headers from other manufacturers using identical 2.00mm pitch and 70-position specifications. Verify mechanical dimensions and solder pad layouts match exactly. Ensure equivalent plating thickness and material composition for performance parity.