A-SL200-EG-Z31MP1

Headers, Male Pins Overview

The A-SL200-EG-Z31MP1 is a surface mount unshrouded header connector manufactured by Assmann WSW Components. It features a 31-position configuration with a 2.00mm (0.079 inch) pin spacing. The component utilizes a right-angle side entry design, facilitating compact PCB layouts. It is constructed for solder termination and operates within standard electronic assembly environments.

Headers, Male Pins Feature Summary

• Right-angle surface mount construction for space-efficient board integration
• Unshrouded header design with side entry orientation
• Solder termination method ensuring secure PCB attachment

Headers, Male Pins Applications

• General purpose electronic circuit interconnections
• Compact consumer device internal wiring
• Industrial control module signal routing

Headers, Male Pins Procurement Notes

Verify the specific reel quantity and tape specifications required for automated pick-and-place assembly processes. Confirm that the right-angle orientation aligns with the mechanical constraints of the target enclosure. Ensure compatibility with standard reflow soldering profiles to maintain joint integrity during manufacturing.

Headers, Male Pins Selection Notes

Select this component when a low-profile, right-angle connection is necessary for dense circuit boards. The 2.00mm pitch offers a balance between current capacity and spatial efficiency. Consider the side entry feature if cable or harness routing requires lateral access rather than vertical clearance.

Headers, Male Pins Part Context

This part belongs to the A-SL200 series of connectors from Assmann WSW Components. The series provides various configurations for surface mount applications. The Z31 designation indicates the specific 31-pin count variant within this product family.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 31-pin count, 2.00mm pitch, and right-angle surface mount form factor. Verify that alternative manufacturers offer identical side-entry geometry and compatible solder termination methods to ensure seamless integration.