A-SL254-EA-Z16MP1

Headers, Male Pins Overview

The A-SL254-EA-Z16MP1 is a surface mount header connector from the Assmann WSW Components series. It features 16 positions with a 0.100-inch (2.54mm) mating pitch. The connector utilizes square contact shapes and unshrouded design. Insulation material is polyamide (PA6T/Nylon 6T) with an insulation height of 0.098 inches (2.50mm). Contact finish on the post is tin-plated.

Headers, Male Pins Feature Summary

• Surface mount mounting type for automated assembly
• Cuttable header configuration for flexible circuit length management
• Unshrouded design with square contact geometry

Headers, Male Pins Applications

• General electronic interconnections
• PCB-to-PCB communication links
• Industrial control system wiring

Headers, Male Pins Procurement Notes

Verify that the specific part number matches the required pin count and pitch specifications before ordering. Confirm surface mount compatibility with your PCB fabrication process. Ensure the unshrouded design aligns with your mechanical enclosure constraints. Cross-reference manufacturer documentation to confirm material composition and plating details.

Headers, Male Pins Selection Notes

Select this component when a low-profile, surface mount solution is required for standard 2.54mm pitch applications. Consider the unshrouded nature for open-space designs where shrouding is unnecessary. Evaluate the cuttable feature if custom cable lengths are needed. Verify thermal and electrical ratings against system requirements.

Headers, Male Pins Part Context

This component belongs to the rectangular connector family produced by Assmann WSW Components. The company specializes in IC sockets and IDC connectors for flat cable applications. This specific model represents a standard header variant within their broader portfolio of interconnect solutions.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 16-position count, 2.54mm pitch, and surface mount package. Verify identical contact finish and insulation material properties. Ensure mechanical dimensions allow for direct footprint replacement without PCB redesign.