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A-SL254DG18-083KPB01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is PIN HEADER. Review the specifications below when checking this part for your BOM.
The A-SL254DG18-083KPB01 is a header connector from the ASSMANN WSW A-SL254 series. It features an 18-position configuration with a 2.54 mm pitch and through-hole termination. The component utilizes gold-plated bronze contacts for reliable signal transmission. Designed for direct installation, it supports a maximum voltage of 500V and operates within a temperature range of -40°C to 105°C. The housing meets UL 94 V-0 flammability standards, ensuring safety in various electronic assemblies.
Verify the specific part number against official manufacturer documentation to confirm pin count and contact plating specifications. Ensure compatibility with mating headers regarding pitch and row configuration. Check for RoHS compliance status if required by project regulations. Confirm storage conditions to maintain contact integrity prior to assembly.
Select this component when a 2.54 mm pitch header with 18 positions is required for through-hole applications. Consider the 500V rating and 105°C operating temperature limit for environmental suitability. Verify that the gold-plated contacts meet the necessary conductivity requirements for the intended signal or power load.
This connector belongs to the A-SL254 series, which is characterized by its 2.54 mm spacing standard. The series is designed for general electronic applications requiring reliable through-hole connections. Assmann WSW Components manufactures these connectors as part of their standard catalog offerings for PCB interconnect solutions.
Compatible substitutes must match the 2.54 mm pitch, 18-position count, and through-hole termination style. Verify that alternative components offer equivalent voltage ratings and temperature ranges. Ensure physical dimensions and housing material properties align with existing design constraints.
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