A-WBP-D008EA-13SR03

Headers, Male Pins Overview

The A-WBP-D008EA-13SR03 is a surface mount, right-angle header connector manufactured by Assmann WSW Components. It features a 13-position configuration with a 1.25mm (0.049 inch) pitch. The component utilizes selective gold flash plating on the contact area and tin plating on the solder area over a nickel underlayer. It is designed for board-to-wire applications in compact rectangular header families.

Headers, Male Pins Feature Summary

• Surface mount right-angle design for space-constrained PCB layouts
• Selective gold flash contact plating for reliable signal transmission
• Tin-plated solder areas with nickel underlayer for secure attachment

Headers, Male Pins Applications

• Compact electronic device interconnections
• Board-to-wire assembly in consumer electronics
• High-density circuit board connections

Headers, Male Pins Procurement Notes

Verify the specific pin count and pitch against the official datasheet to ensure compatibility with mating connectors. Confirm RoHS compliance status and moisture sensitivity level requirements for your manufacturing process. Check for any specific handling instructions related to the surface mount package type.

Headers, Male Pins Selection Notes

Select this component when a low-profile, right-angle surface mount header is required for 1.25mm pitch applications. Ensure the PCB footprint matches the manufacturer's recommended land pattern. Consider the mechanical stability provided by the right-angle orientation for cable routing needs.

Headers, Male Pins Part Context

This part belongs to the WBP-D008EA series of compact rectangular headers from Assmann WSW Components. The series offers various position counts and plating options to suit different connectivity requirements. It is part of the company's standard solution portfolio for modern electronic assemblies.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 1.25mm pitch, 13-position count, and surface mount right-angle form factor. Verify that alternative components offer compatible contact plating specifications and identical mounting dimensions to ensure seamless integration without PCB redesign.