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A-WBP-K001EA-09RR01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER, 2.00MM, 9P. Review the specifications below when checking this part for your BOM.
The A-WBP-K001EA-09RR01 is a connector header manufactured by Assmann WSW Components. It features a through-hole mounting style with a right-angle orientation. The component has a total of 9 positions and utilizes a 0.079-inch (2.00mm) pitch spacing between contacts. This specific part number designates the configuration for this multi-position header assembly within the manufacturer's product lineup.
Verify the exact pin count and pitch specifications against the target printed circuit board layout to ensure mechanical compatibility. Confirm that the right-angle orientation aligns with the enclosure constraints and signal routing requirements of the final assembly design before placing orders.
Select this component when a right-angle, through-hole header with a 2.00mm pitch is required. Ensure the application environment does not exceed the thermal limits of standard plastic headers. Consider the physical height and mating force requirements relative to the connected cable or wire harness assembly.
This part belongs to the broader category of connector headers produced by Assmann WSW Components. These components are designed for reliable electrical connectivity in various electronic systems. The specific model indicates a standardized industrial connector solution used for signal and power distribution on printed circuit boards.
Explore related parts through Rectangular Connectors, Connectors, Interconnects, all product categories, ChipApex homepage.

A-WBP-K001EA-09RR01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER,…
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A-WBP-K001EA-09RR01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER,…
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