A-WBP-K015EG-13TB03

Headers, Male Pins Overview

The A-WBP-K015EG-13TB03 is a board connector manufactured by ASSMANN WSW Components. It features a male header configuration with 13 contacts arranged in a single row. The component utilizes a 2.00 mm (0.079 inch) pitch and employs straight through-hole solder terminals for PCB attachment. Designed for wire-to-board applications, it provides reliable electrical interconnection within electronic assemblies.

Headers, Male Pins Feature Summary

• Male header configuration for secure mating
• Single-row contact arrangement
• Through-hole solder termination method

Headers, Male Pins Applications

• Wire-to-board interconnections
• General electronic circuit assembly
• Industrial control systems

Headers, Male Pins Procurement Notes

Verify the specific pin count of 13 positions and the 2.00 mm pitch against design requirements. Confirm the straight orientation and through-hole mounting style matches the PCB layout. Ensure the male gender designation aligns with the mating connector specifications to guarantee proper interface compatibility.

Headers, Male Pins Selection Notes

Select this component when a 13-position male header with a 2.00 mm pitch is required. The straight through-hole design suits standard vertical mounting needs. Consider the single-row layout for space-constrained applications requiring linear contact distribution on the board.

Headers, Male Pins Part Context

This part belongs to the A-WBP series of board connectors from ASSMANN WSW Components. The series offers various contact counts and configurations. This specific model represents a mid-range option within the product line, focusing on standard through-hole connectivity solutions for general-purpose electronics.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 13-pin count, 2.00 mm pitch, male gender, and through-hole mounting type. Verify that any alternative component maintains identical mechanical dimensions and electrical ratings to ensure seamless integration without redesigning the PCB footprint.