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A-WBP-L006EG-03SR01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER, 2.50MM, 3P. Review the specifications below when checking this part for your BOM.
The A-WBP-L006EG-03SR01 is a wire-to-board connector header manufactured by Assmann WSW Components. It features a 3-position configuration with a 2.50 mm (0.098 inch) pitch, designed for surface mount technology. The component utilizes a wafer-style housing and is intended for board-to-wire interconnections.
Verify the specific suffix SR01 against the manufacturer's current documentation to confirm availability status and exact pinout configuration. Ensure compatibility with surface mount reflow processes and check for any recent RoHS or REACH compliance updates in the official datasheet before finalizing procurement specifications.
Select this component when a low-profile, surface mount header with a 2.50 mm pitch is required for three-wire connections. Confirm that the mating wire gauge and terminal type are compatible with the wafer housing design. Validate mechanical retention requirements for the specific application environment.
This part belongs to the A-WBP series of wafer headers from Assmann WSW Components. The series offers various position counts and mounting styles, including through-hole and surface mount options, catering to diverse connectivity needs in modern electronic assemblies.
Direct substitutes must match the 3-position count, 2.50 mm pitch, and surface mount footprint. Verify housing dimensions and terminal locking mechanisms to ensure interchangeability without redesigning the PCB layout.
Explore related parts through Rectangular Connectors, Connectors, Interconnects, all product categories, ChipApex homepage.

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